JPH0570305B2 - - Google Patents

Info

Publication number
JPH0570305B2
JPH0570305B2 JP62115212A JP11521287A JPH0570305B2 JP H0570305 B2 JPH0570305 B2 JP H0570305B2 JP 62115212 A JP62115212 A JP 62115212A JP 11521287 A JP11521287 A JP 11521287A JP H0570305 B2 JPH0570305 B2 JP H0570305B2
Authority
JP
Japan
Prior art keywords
semiconductor chip
insulating sheet
resin
present
external leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62115212A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63278356A (ja
Inventor
Takashi Kusakari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP11521287A priority Critical patent/JPS63278356A/ja
Publication of JPS63278356A publication Critical patent/JPS63278356A/ja
Publication of JPH0570305B2 publication Critical patent/JPH0570305B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP11521287A 1987-05-11 1987-05-11 半導体集積回路 Granted JPS63278356A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11521287A JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11521287A JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS63278356A JPS63278356A (ja) 1988-11-16
JPH0570305B2 true JPH0570305B2 (en]) 1993-10-04

Family

ID=14657140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11521287A Granted JPS63278356A (ja) 1987-05-11 1987-05-11 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS63278356A (en])

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60109256A (ja) * 1983-11-18 1985-06-14 Oki Electric Ind Co Ltd プラスチツク型半導体装置

Also Published As

Publication number Publication date
JPS63278356A (ja) 1988-11-16

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